May 24, 2019. Our recent research on signaling methods for high-speed chip-to-chip communications has been accepted for publication in IEEE MWCAS’2019 (Dallas, US) ! The paper is entitled: Spectrum Efficient Communication Over Copper Using Hybrid Amplitude and Spatial Signaling. Congratulations to the team: Rajath Bindiganavile. This article is based on collaboration with an industrial partner [Link].
