May 24, 2019. Our recent research on signaling methods for high-speed chip-to-chip communications has been accepted for publication in IEEE MWCAS’2019 (Dallas, US) ! The paper is entitled: Spectrum Efficient Communication Over Copper Using Hybrid Amplitude and Spatial Signaling. Congratulations to the team: Rajath Bindiganavile. This article is based on collaboration with an industrial partner [Link].
May 30, 2019. We are presenting our recent research results in the field of wireline communications in the 2019 North American Workshop on Silicon Photonics for High-Performance Computing – SPHPC (Rocky Mountain, Colorado, US) ! The seminar is entitled: Spectrum Efficient Communication Over Copper Using Hybrid Amplitude and Spatial Signaling. A poster will be also presented by Rajath Bindiganavile, entitled: Toward Tb/s/mm Communications Over Copper.
June 11, 2019. A paper entitled: A 1.04-pJ/b 417Gb/s/mm USR Link in 16nm FinFET will be presented in VLSI Symposium, in Kyoto, Japan [Link].